Want to get featured here? Explore premium visibility opportunities.

Contact us

AI NewsFoundation for India’s First 3D Chip Packaging Unit Laid in Odisha

Foundation for India’s First 3D Chip Packaging Unit Laid in Odisha

6:04 PM IST · April 20, 2026

Foundation for India’s First 3D Chip Packaging Unit Laid in Odisha

The project targets AI, 5G and defence sectors, with production set to begin by 2028.

read more